Me postulé a través de un reclutador. El proceso tomó 2 semanas. Acudí a una entrevista en WD (`Omer) en jul 2021
Entrevista
Test in a room with other candidates. afterwards a personal interview. The personal interview with the team leader and a team leader from another team. They were very nice and explained about the company and the job.
Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview. Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview.
Me postulé a través de una facultad o universidad. El proceso tomó 1 día. Acudí a una entrevista en WD (Nueva Delhi) en sept 2019
Entrevista
Written test MCQ, 3 PARTS 20 QUESTION EACH - C/C++ DS - APTITUDE - DIGITAL ELECTRONICS 2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
Preguntas de entrevista [1]
Pregunta 1
2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
