Me postulé a través de una facultad o universidad. El proceso tomó 2 semanas. Acudí a una entrevista en Transfix (New York, NY) en ene 2017
Entrevista
Very well structured interview process. Started with usual HR round, followed by phone interview with code pad with one of the engineers to test coding ability. Then I was called for on-site which had 4 technical round and one HR. Tech rounds mostly focused on Algorithms and Design oriented questions. Overall experience was really nice.
Only negative thing is that persons who were interviewing were bit unprepared.