Phone interview: 1. showed me a plastic housing picture, few questions about injection molding (which features will you improve? where is core/cavity? which direction will plastic be injected in? how to make side holes in injection mold?) 2. If you need to design a electrical packaging which needs to be mounted underneath of the vehicle, which requirements will you ask for? which tests will you recommend to do? How you do those tests? Written test (open book): Covers ME and EE questions, beam, beam stiffness, injection molding, buckling loads, vibration, thermal expansion, FBD, ME drawings, fluid mechanics, mfg methods, thermal conduction, RLC circuit, mechanical bonding calculation.... 2nd phone interview: 1. Name hardest project I did and he dig into it 2. how to deal with a vendor who made bad parts

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