Me postulé a través de una facultad o universidad. El proceso tomó 2 días. Acudí a una entrevista en SignOff Semiconductors (Mangalore) en mar 2023
Entrevista
Three Rounds in the interview process.
First-round was MCQs (electronics topics) basic electronics, digital logic, VLSI concepts, and a few numerical problems.
2nd round technical interview. Digital logic design, VLSI, analog topics.
3rd HR interview
Preguntas de entrevista [1]
Pregunta 1
Explain different types of flip-flops and their working.
Questions on multiplexers and IC fabrication.
Me postulé a través de una facultad o universidad. El proceso tomó 3 días. Acudí a una entrevista en SignOff Semiconductors (Bengaluru) en mar 2023
Entrevista
It was a very good experience. The interviewers were very professional and the interview went quite smooth. They asked many basic questions and it was very interactive. I was very happy with the process.
Preguntas de entrevista [1]
Pregunta 1
Basic questions related to Digital Design, Analog Electronics, CMOS fundamentals.
Me postulé a través de una facultad o universidad. Acudí a una entrevista en SignOff Semiconductors (Bengaluru) en mar 2023
Entrevista
Good. Applied through pool campus placement process. The process took place in 2 days . First round is written test. It included aptitude,verbal, logical reasoning and electronics questions. Each wrong answer had -1 mark and right answer +1. Next two round of interviews. Technical and HR. Interviewers were nice and kind.
Preguntas de entrevista [1]
Pregunta 1
Basics of electronic. Digital electronics. Analog circuits. VLSI questions
