Me postulé en línea. El proceso tomó 2 meses. Acudí a una entrevista en Seagate Technology (Bloomington, MN) en ene 2020
Entrevista
Interviewed with six different people with 6 candidates total in a round robin fashion for three hours. It wasn't that bad and the time flew, the interviewers asked typical questions about your resume.
They gave me an offer and a start date, even did a background check, I accepted. Then a week goes by and I get a call saying that the job may not be available as they are reviewing their open positions. This was my first job offer after college so I told my family and friends and put my two week notice in at my retail job. Then I had to retract all of that. That is a horrible practice for a company and I cannot stress enough, if this is how the company runs, do not work here.
Me postulé a través de una recomendación de un empleado. Acudí a una entrevista en Seagate Technology (Bloomington, MN)
Entrevista
Everyone is friendly. After a presentation, I needed to talk with each interviewer per half an hour. Some might got interested in my presentation, some would directly ask questions based on my resume, and some managers just wanted me to ask something. Almost everyone would also throw me some common questions (about teamwork, pressure, motivation) from a page which was required by HR department. Those questions are not hard to address if you prepared similar topics through google. Although Seagate did not give me an offer since bad market situation in these two years, I still encourage people to apply their positions.
Preguntas de entrevista [2]
Pregunta 1
How would you do if your manager or a project gave you a lot of pressure?
Me postulé en línea. El proceso tomó 4 semanas. Acudí a una entrevista en Seagate Technology (Derry, Northern Ireland)
Entrevista
First round comprised of a Skype Interview, and presenting a project that I had completed. The interview on campus was two rounds one with potential colleagues and one with higher up HR.
Preguntas de entrevista [1]
Pregunta 1
Questions on the process and statistical errors with relation to their wafers.
