Me postulé a través de una facultad o universidad. El proceso tomó 2 meses. Acudí a una entrevista en Apple (Raleigh, NC) en mar 2016
Entrevista
1 campus interview followed by 3 phone rounds. The campus interview was long and hard and involved drawing HW related state diagrams and also class work. The phone rounds were more problem solving types and didn’t involve writing specific code.
Me postulé a través de una facultad o universidad. El proceso tomó más de 2 meses. Acudí a una entrevista en Apple (Nueva Delhi) en may 2021
Entrevista
I applied through TnP cell. After two months we got a mail for shortlisted candidates. There were 4 rounds of interview for hardware internship. Questions were from C programming, bit manipulation, Amplitude modulation, frequency modulation, sampling.
Preguntas de entrevista [1]
Pregunta 1
swap odd and even bit position ( by bit manipulation)
power of 2( bit manipulation)
difference between struct and global data type.
Me postulé a través de una facultad o universidad. El proceso tomó 2 meses. Acudí a una entrevista en Apple en sept 2017
Entrevista
1 one campus interview followed by 4 phone interviews with various team members. Questions were relevant to the position (PCB). The interviewers were all nice but the process was slow overall.
Me postulé a través de una recomendación de un empleado. Acudí a una entrevista en Apple (Cupertino, CA) en ago 2017
Entrevista
The interview started with a short in-person interview (about 45 min) to gauge interest in the position. The following interview was a full day interview lasting about 7 hours. I met with several members of the team who asked about my background and skills.